The Open Corrosion Journal

2009, 2 : 71-76
Published online 2009 March 13. DOI: 10.2174/1876503300902010071
Publisher ID: TOCORRJ-2-71

Corrosion Behavior of Copper in Chloride Media

M.M. Al-Abdallah , A.K. Maayta , M.A. Al-Qudah and N.A.F. Al-Rawashdeh
Department of Applied Chemical Sciences, Jordan University of Science and Technology, P.O. Box 3030, Irbid-22110, Jordan

ABSTRACT

The electrochemical behavior of copper in 0.05 M HCl and 0.05 M NaCl carried out at open-circuit potential and at constant anodic potential after one hour has been investigated using electrochemical impedance spectroscopy (EIS) at 20 °C, 40 °C and 60 °C. The formation of copper chloride (CuCl) film does not protect copper from dissolution in the chloride media. The physical properties of the passive film such as, polarization resistance (Rp), capacitance (C), loss factor (%P), Warburg diffusion coefficient (W) and Kugel diffusion constant (k) were obtained from EIS measurements. Also, the radii of the pores formed as a result of anodic polarization have been calculated.

Keywords:

Copper, NaCl, HCl, impedance (EIS), corrosion.