Three-dimension Test Wrapper Design based on Multi-objective Cuckoo Search

ABSTRACT

The main methodologies and recent patents on test wrapper design have been reviewed in this paper. The design of three-dimension test wrapper for IP module in System on Chip is a NP Hard problem. As the test time of an IP module is determined by the longest wrapper scan chain and each TSV has area costs and is a potential source of defects, it is necessary to shorten the longest wrapper chain and use less TSV. The paper proposes MOCS (Multi-Objective Cuckoo Search) algorithm to achieve the purpose of minimization of the IP module test time and the number of TSV used. The proposed algorithm, which is based on swarm intelligence, through levy flight operation and discovery rate, can achieve balance of the wrapper scan chains and use less TSV. Typical IP modules in ITC'02 benchmarks are used to prove the effectiveness of the proposed algorithm. Experimental results show that the algorithm can get better Pateto solutions Set, compared with NSGAII, and can reduce the test cost.

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