The Open Mechanical Engineering Journal

2015, 9 : 761-768
Published online 2015 September 30. DOI: 10.2174/1874155X01509010761
Publisher ID: TOMEJ-9-761

Modeling and Simulation of Nanofluid Minimum Quantity Lubrication Surface Grinding Thermal Stress

Yanbin Zhang , Changhe Li , Min Yang , Dongzhou Jia , Dongkun Zhang and Xiaowei Zhang
School of Mechanical Engineering, Qingdao Technological University, 266033, China.

ABSTRACT

The model of surface grinding with a nanoparticle jet flow of MQL was established. The surface grinding thermal stress of three workpiece materials, namely, 45 Steel, 2Cr13, and nano-ZrO2 dental ceramic, were numerically simulated. Results show that dry grinding generates larger tensile stress, whereas MQL grinding generates larger compressive stress. The finished surface of workpiece produces large tensile stress in grinding direction. With the increase of cutting depth, the time-related variation of thermal stress on finished surface slows down gradually. Residual stress is inversely proportional to cutting depth. With the increase of cutting depth, the finished surface of workpiece is firstly dominated by large tensile stress, which decreases continuously until reaching the maximum compressive stress. Deeper layer is less influenced by temperature field, manifested by smaller stress value and slight variation of the whole stress field.

Keywords:

Cooling performance, grinding zone temperature, minimum quantity lubrication (MQL), nano-particles, jet flow, thermal stress, lubricating properties, tribological features.